PUBLICATION

Bio-integrated Electronics Lab.

Cover

Epidermal Electronics with Advanced Capabilities in Near-Field Communication

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작성자 최고관리자 작성일 24-09-02 13:36

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Author
Jeonghyun Kim , Anthony Banks , Huanyu Cheng , Zhaoqian Xie , Sheng Xu , Kyung-In Jang , Jung Woo Lee , Zhuangjian Liu , Philipp Gutruf , Xian Huang , Pinghung Wei , ... , Yonggang Huang , Sanjay Gupta , Ungyu Paik , * and John A. Rogers *
Journal
small
Vol
Vol 11
Page
906–912

Introduction


We demonstrate materials, mechanics designs and integration strategies for near fi eld communication (NFC) enabled electronics with ultrathin construction, ultralow modulus, and ability to accommodate large strain deformation. These attributes allow seamless, conformal contact with the skin and simultaneous capabilities for wireless interfaces to any standard, NFC enabled smartphone, even under extreme deformations and after/during normal daily activities. Detailed experimental studies and theoretical modeling of the coupled mechanical and electromagnetic responses of these systems establish foundational understanding of their behavior. These materials and device architectures have potential for utility in other types of radio frequency (RF) electronic systems and for use on other organs of the body.