PUBLICATION

Bio-integrated Electronics Lab.

Cover

Electronic Stuctures: Mechanically Guided Post-Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)

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작성자 최고관리자 작성일 24-09-02 13:36

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Author
Bong Hoon Kim, Fei Liu, Yongjoon Yu, Hokyung Jang, Zhaoqian Xie, Kan Li, Jungyup Lee, Ji Yoon Jeong, Arin Ryu, Yechan Lee, Do Hoon Kim, Xueju Wang, KunHyuck Lee, Jong Yoon Lee, Sang Min Won, Nuri Oh, Jeonghyun Kim, Ju Young Kim, Seong‐Jun Jeong, Kyung‐In
Journal
Advanced Functional Materials
Vol
Vol 28, Issue 48
Page
1870344

Graphical Abstract

In article number 1803149, Yonggang Huang, Yihui Zhang, John A. Rogers, and co-workers present deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy to 3D FPCB technologies creates immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.