Electronic Stuctures: Mechanically Guided Post-Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)
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작성자 최고관리자 작성일 24-09-02 13:36본문
- Journal
- Advanced Functional Materials
- Vol
- Vol 28, Issue 48
- Page
- 1870344
Graphical Abstract
In article number 1803149, Yonggang Huang, Yihui Zhang, John A. Rogers, and co-workers present deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy to 3D FPCB technologies creates immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.